EDN.com Components and Products Design CenterNews, in-depth tutorial feature articles, and Design Ideas published in EDN.com's Components/New Products Design Center.All about surface-mount ferrites- August 21, 2008 You may be surprised to learn that the performance of a ferrite bead in any power-filtering application can vary by more than a factor of 10, depending on the magnitude of dc current passing through the part during actual operation.http://www.edn.com/article/CA6586229.html?rssid=240 ESR calculations for electrolytic capacitors at lower temperatures- August 20, 2008 Use this empirically derived formula—and online calculator—to determine ESR at the low end of the temperature range.http://www.edn.com/article/CA6588218.html?rssid=240 Determining end-of-life, ESR, and lifetime calculations for electrolytic capacitors at higher temperatures- August 20, 2008 Employing the Arrhenius equation.http://www.edn.com/article/CA6588368.html?rssid=240 Elpida, Qimonda may set up joint manufacturing activities- August 8, 2008 Following Elpida Memory Inc’s announcement this week that it plans to set up a 300-mm wafer fab in China with a venture investment group that leverages technology created jointly with Qimonda AG, the Munich, Germany-based memory company is confirming that the two are continuing to discuss manufacturing partnership options. iSuppli Corp, which ranks Elpida and Qimonda as third and fifth largest DRAM makers, is predicting more turbulent times ahead for DRAM.http://www.reed-electronics.com/electronicnews/article/CA6585760.html?rssid=240 Infineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard- August 7, 2008 Targeting the manufacture of future-generation semiconductor packages, STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG said today that they have agreed to jointly develop the next-generation of embedded wafer-level ball grid array technology, based on Infineon’s first-generation technology.http://www.reed-electronics.com/electronicnews/article/CA6585445.html?rssid=240 Miniature photocoupler features high-speed isolated switching- August 7, 2008 Toshiba Electronics Europe has launched the TLP117 miniature photocoupler for applications requiring a combination of isolation, high-speed data transfer, and low-power operation.http://www.edn.com/article/CA6582861.html?rssid=240 Revisiting electronic ink- August 7, 2008 Prying Eyes: Electronic ink has changed in the seven years since we last took a look at it.http://www.edn.com/article/CA6582858.html?rssid=240 Avnet inks HB-LED-focused distribution agreement- August 7, 2008 Avnet Electronics Marketing and the Avnet LightSpeed team will work with customers on the application of Nuventix’s HB-LED-focused technology by offering specialized engineering and system-level design assistancehttp://www.reed-electronics.com/electronicnews/article/CA6585421.html?rssid=240 |